Haida Equipment will be at the 2026 ISTA Annual Conference in Shanghai, China, from September 16-17, 2026. The conference is an important event for the worldwide packaging and transportation industries. It will provide an opportunity for international industry professionals to meet and develop solutions that provide secure and intelligent transit.
Mr. Mak Ho Fung, who is Executive Director at Haida Equipment Co., Ltd., will be giving a keynote address as part of the Transport Packaging Session. Mr. Mak will present “How to Better Integrate New Technologies to Promote Packaging Transition from ‘Passive Protection’ to Intelligent Active Management”, and will discuss the impacts that new technology will have on our industry.
The discussion will examine the transition from passive to active monitoring in addition to exploring the impact that ISTA Standards have had on global packaging and transport, as well as the use of IOT and AI within equipment. Also, the session will provide perspectives from ISTA experts on where the future of packaging/testing may be headed.
Haida Equipment is a manufacturer of testing equipment for all three categories of testing – packaging, material, and reliability testing, and they offer solutions that adhere to international standards (ISTA, ASTM, ISO).
We look forward to meeting industry experts and our partners during the ISTA Annual Conference 2026 to discuss the future of smart transportation and packaging.